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90 NON-CONVENTIONAL METAL PRECIPITATION AT A PRINTED CIRCUIT BOARD MANUFACTURER: A CASE STUDY Charles Ficker, Senior Chemist William S. Carter, Product Manager DuBois Chemicals Cincinnati, Ohio 45202 Jim Martin, Plant Chemist Circuit Center, Inc. Dayton, Ohio 45440 INTRODUCTION Circuit Center, Inc. is a manufacturer of printed circuit boards located in Dayton, Ohio. The production of circuit boards is accomplished through a series of wet chemical processes, and a number of graphic art procedures. Details of production techniques will vary from one facility to another; however, the basic processes of board etching, electroless and electrolytic copper plating, and water rinsing are consistent. The great majority of wastewater at Circuit Center, as at all board shops, is generated in the rinsing operations. Here water picks up organic material, suspended solids and metal ions, including: copper, tin, lead, nickel and other species. Another significant source of copper at Circuit Center is from the use of a proprietary ammonia etchant. This is used to dissolve away unnecessary copper from the circuit board laminate. This ammonia as well as the electroless plating process results in copper ions which are compiexed and difficult to precipitate. To protect human health and the environment, the toxic metal ions and other contaminants of concern must be removed prior to discharge. As a circuit board manufacturer, Circuit Center falls under the Federal Environmental Protection Agency (EPA) guidelines for metal finishers. Local ordinances for wastewater discharge must be no less stringent than the Federal EPA Guidelines. Also per federal law, any sludge from an electroplating rinse treatment is a categorical hazardous waste and subject to the regulations of the Resource Conservation and Recovery Act (RCRA) and its amendments. When Circuit Center built a new facility in 1983, new EPA regulations were imminent, becoming effective in 1984 (See Table I). The management of Circuit Center made the conscious decision to minimize environmental impact. Among other actions, the shop was made solvent free, using only aqueous cleaning, and an engineering company was selected to install a state-of-the-art waste treatment system. However, when Circuit Center began operations in 1984, it became apparent there would be difficulties with compliance. The federal limit of 4.5 mg/L copper and 0.6 mg/L lead were attainable. However, the local control authority, Montgomery County Sewer District, planned limits Table I. Printed Circuit Board Pretreatment Regulations 1984 Contaminant 1 Day Max 4 Day Average Cyanide, Total 1.9 mg/L 1.0 mg/L Copper 4.5 mg/L 2.7 mg/L Nickel 4.1 mg/L 2.7 mg/L Chromium, Total 7.0 mg/L 4.0 mg/L Zinc 4.2 mg/L 2.6 mg/L Lead 0.6 mg/L 0.4 mg/L Cadmium 1.2 mg/L 0.7 mg/L Total Metals 10.5 mg/L 6.8 mg/L 45th Purdue Industrial Waste Conference Proceedings, © 1991 Lewis Publishers, Inc., Chelsea, Michigan 48118. Primed in U.S.A. 783
Object Description
Purdue Identification Number | ETRIWC199090 |
Title | Non-conventional metal precipitation at a printed circuit board manufacturer : a case study |
Author |
Ficker, Charles Carter, William S. Martin, Jim |
Date of Original | 1990 |
Conference Title | Proceedings of the 45th Industrial Waste Conference |
Conference Front Matter (copy and paste) | http://e-archives.lib.purdue.edu/u?/engext,41605 |
Extent of Original | p. 783-790 |
Collection Title | Engineering Technical Reports Collection, Purdue University |
Repository | Purdue University Libraries |
Rights Statement | Digital object copyright Purdue University. All rights reserved. |
Language | eng |
Type (DCMI) | text |
Format | JP2 |
Date Digitized | 2009-08-20 |
Capture Device | Fujitsu fi-5650C |
Capture Details | ScandAll 21 |
Resolution | 300 ppi |
Color Depth | 8 bit |
Description
Title | page 783 |
Collection Title | Engineering Technical Reports Collection, Purdue University |
Repository | Purdue University Libraries |
Rights Statement | Digital copyright Purdue University. All rights reserved. |
Language | eng |
Type (DCMI) | text |
Format | JP2 |
Capture Device | Fujitsu fi-5650C |
Capture Details | ScandAll 21 |
Transcript | 90 NON-CONVENTIONAL METAL PRECIPITATION AT A PRINTED CIRCUIT BOARD MANUFACTURER: A CASE STUDY Charles Ficker, Senior Chemist William S. Carter, Product Manager DuBois Chemicals Cincinnati, Ohio 45202 Jim Martin, Plant Chemist Circuit Center, Inc. Dayton, Ohio 45440 INTRODUCTION Circuit Center, Inc. is a manufacturer of printed circuit boards located in Dayton, Ohio. The production of circuit boards is accomplished through a series of wet chemical processes, and a number of graphic art procedures. Details of production techniques will vary from one facility to another; however, the basic processes of board etching, electroless and electrolytic copper plating, and water rinsing are consistent. The great majority of wastewater at Circuit Center, as at all board shops, is generated in the rinsing operations. Here water picks up organic material, suspended solids and metal ions, including: copper, tin, lead, nickel and other species. Another significant source of copper at Circuit Center is from the use of a proprietary ammonia etchant. This is used to dissolve away unnecessary copper from the circuit board laminate. This ammonia as well as the electroless plating process results in copper ions which are compiexed and difficult to precipitate. To protect human health and the environment, the toxic metal ions and other contaminants of concern must be removed prior to discharge. As a circuit board manufacturer, Circuit Center falls under the Federal Environmental Protection Agency (EPA) guidelines for metal finishers. Local ordinances for wastewater discharge must be no less stringent than the Federal EPA Guidelines. Also per federal law, any sludge from an electroplating rinse treatment is a categorical hazardous waste and subject to the regulations of the Resource Conservation and Recovery Act (RCRA) and its amendments. When Circuit Center built a new facility in 1983, new EPA regulations were imminent, becoming effective in 1984 (See Table I). The management of Circuit Center made the conscious decision to minimize environmental impact. Among other actions, the shop was made solvent free, using only aqueous cleaning, and an engineering company was selected to install a state-of-the-art waste treatment system. However, when Circuit Center began operations in 1984, it became apparent there would be difficulties with compliance. The federal limit of 4.5 mg/L copper and 0.6 mg/L lead were attainable. However, the local control authority, Montgomery County Sewer District, planned limits Table I. Printed Circuit Board Pretreatment Regulations 1984 Contaminant 1 Day Max 4 Day Average Cyanide, Total 1.9 mg/L 1.0 mg/L Copper 4.5 mg/L 2.7 mg/L Nickel 4.1 mg/L 2.7 mg/L Chromium, Total 7.0 mg/L 4.0 mg/L Zinc 4.2 mg/L 2.6 mg/L Lead 0.6 mg/L 0.4 mg/L Cadmium 1.2 mg/L 0.7 mg/L Total Metals 10.5 mg/L 6.8 mg/L 45th Purdue Industrial Waste Conference Proceedings, © 1991 Lewis Publishers, Inc., Chelsea, Michigan 48118. Primed in U.S.A. 783 |
Resolution | 300 ppi |
Color Depth | 8 bit |
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